The lead frame manufactured by stamping process plays an important role in connecting semiconductor to PCB board. As a result of the miniaturization of semiconductor, its corresponding lead frame punch has been narrow. In case of the punch with high slenderness ratio such as lead frame punch, the punch can be broken suddenly due to buckling. To prevent the fracture of lead frame punch, some manufacturers have experientially attached stiffeners to weak parts of punch. The purpose of this study, therefore, is to suggest the guideline far design of stiffened punch. The optimal position and the number of stiffeners to be attached to punch are investigated by elastic buckling analysis. The elastic buckling analysis consists of the eigenvalue buckling analysis and nonlinear buckling analysis. The critical buckling load of elastic buckling analysis is compared with that of buckling test. Finally, the guideline far attaching stiffeners is suggested through analysis of cross section of lead frame punch such as moment of inertia and eccentricity.