The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${pm}10;ppm/^{circ}C$ and $-6{sim}+1;ppm/^{circ}C$ after annealing and packaging process. The TCR values were $-3{sim}1;ppm/^{circ}C$ (ratio of variation : about 0.02 %) and $-30{sim}20;ppm/^{circ}C$ (ratio of variation : about $0.5{sim}1;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.