Novolac is widely used as the primary solid component of most photoresists in semiconductor and microelectronic devices. In this study, novolac resins were prepared by condensation of 35% formaldehyde with phenolic compounds such as m-/p-cresol, 2,5-dimethylphenol and bisphenol A in the presence of oxalic acid as catalyst. The average molecular weight $(M_w)$ of these novolac resins has been varied on the changing of mixing ratio of m-/p-cresol/2,5-dimethylphenol/bisphenol A or formaldehyde/phenolic compound. Also, thermal properties of novolac were observed by TGA.