- 마이크로플루트 골판지의 열전도도 및 전기저항 특성에 대한 연구
- ㆍ 저자명
- 엄기증,조용민,Um. Gi-Jeung,Cho. Yong-Min
- ㆍ 간행물명
- 펄프 종이기술
- ㆍ 권/호정보
- 2007년|39권 2호|pp.45-53 (9 pages)
- ㆍ 발행정보
- 한국펄프종이공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
When micro flute corrugated paperboards are used for food packaging, they necessarily need to meet the requirements for the distribution, transportation, and storage of food. The requirements could vary ac-cording to the contents in the packaging boxes. Microflute corrugated packaging paperboard for hot foods such as just-made coffee and hamburger requires to have a decent resistance property against high temperature. Along with a recent trend for small-quantity-multi-item upgraded packaging, semiconductor products and consumer-electronic appliances become to be packed using the environmental friendly micro flute corrugated paperboard. In this case, the electric resistance property of the microflute corrugated paperboard becomes important. This study was carried out to investigate on the thermal conductivity and electric resistance properties of micro flute corrugated paperboard.