This paper describes the influence on partial discharge characteristics of defects at the model XLPE/EPDM interfaces of power cable joints. The defects of void and copper which could inadvertently be present at the joint interface. We measured ${Phi}-n,;{Phi}-q$ patterns by a computer-aided partial discharge measuring system. Several parameters i, e, maximum discharge $q_{max}$ [pC], average discharge q [pC/cycle], and average angle of discharge ${Theta}g$ [deg] were found to depend upon the defect type varying applied voltage. As the result of time evaluation, partial discharges are small different at copper defects, but is decreasing obviously about 20 minutes at void defect. It considered that difference of magnitude of total positive discharge of Q+ [pC] and total negative discharge of Q- [pC] is SPMD(swarming pulsive micro discharges).