As the structure of a mobile phone becomes thin to catch up with a slim product trend, the reliability of a LCD module is on the rise as a big issue for a product design. A drop test is the most basic and important verification method for a mechanical quality control but it requires much time and cost during a product development process. Thus many manufacturers have considered design guide lines using CAE and simulation for more effective usage of limited resources on the market. In this paper, the Maximum Principle Stress of a LCD glass panel is calculated on the basis of explicit FE Analyses method and input conditions are determined according to the general test standard. The design guideline for reliability improvements are suggested on the basis of the results of FE Analysis.