The nitride layer was formed on Ti and Ti-10 wt.%Ta-10 wt.%Nb alloy by a plasma nitriding method. Temperature was selected as the main experimental parameter for plasma nitriding. XRD, EDX, and hardness test were employed to analyze the evolution and material properties of the layer. The SEM observation of TiN nitride layer revealed that the thickness of nitride layer tended to increase with increasing temperature. ${delta}-TiN$, ${varepsilon}-Ti_{2}N$ and ${alpha}-Ti$ phases were detected by XRD analysis and the preferred orientation of TiN nitride layer was obviously observed at (220) plane with increasing temperature. From XRD analysis after step polishing the nitride specimens treated at $850^{circ}C$, as polishing from the surface, TiN and $Ti_{2}N$ phases decreased gradually. After polishing the surface by $4{um}m$, a small amount of $Ti_{2}N$ and ${alpha}-Ti$ phases were observed. The adhesive strength test result indicated that adhesive strength increased with increasing temperature.