Densification behavior of copper powder was investigated to study the effect of an aluminum mold under warm pressing. The low flow stress of an aluminum mold is appropriate to apply hydrostatic stress to powder compacts during compaction under high temperature. The suggested powder metallurgy process is very useful under high temperature since copper powder compacts have higher relative density over axial stress of 100 MPa and show more homogeneity as compared with conventional warm pressing. Elastoplastic constitutive equation proposed by Shima and Oyane was implemented into a finite element program (ABAQUS) for densification behavior under warn pressing by using a metal mold. Finite element results agreed well with experimental data for densification and deformation of copper powder compacts in the mold.