A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760;{mu}m$ was investigated in the stress range of $8{sim}60;MPa$ and at $303;K{sim}393;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.