- 무전해 도금법을 이용한 전자소재용 은-구리 복합분말의 제조
- ㆍ 저자명
- 윤치호,안종관,김동진,손정수,박제신,안양규,Yoon. C.H.,Ahn. J.G.,Kim. D.J.,Sohn. J.S.,Park. J.S.,Ahn. Y.G.
- ㆍ 간행물명
- 한국분말야금학회지
- ㆍ 권/호정보
- 2008년|15권 3호|pp.221-226 (6 pages)
- ㆍ 발행정보
- 한국분말야금학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.