Light guide plate is one of most important components which are composed of back light unit, affecting the quality and performance of LCD. Average brightness and uniformity are especially key factors for designing the light guide unit. These qualities are affected and controlled by the pattern being attached to the back of light guide unit. In order to obtain high brightness and uniformity the optimized pattern design is adopted for LGP. In this study, optimized molding condition for LGP with 0.4 mm thickness was obtained by using the Moldflow simulation software and the optimized pattern for better brightness uniformity was designed for the thickness of the 0.4 mm by trial and error method. The brightness was measured for the different LGP thicknesses and the residual stress analysis was performed for 0.4 mmthickness by the photoelasticity and the results are compared with 0.5 mm, 0.6 mm thickness.