The $I_c$ degradation behavior of critical current in differently processed YBCO and SmBCO CC tapes with IBAD template has been investigated. It has been known that the residual strain in the CC tape will influence the shape of the $I_c$-strain window; $I_c$ may show a peak value if there exist a residual strain induced in the tape during manufacturing. The difference of residual strain may be resulted from the adopted different deposition techniques. In this study, bending test of CC tapes has been done using the Goldacker bending test rig which can produce both compressive and tensile bending strain continuously or alternately to the sample. For SmBCO CC tapes, in continuous compressive bending test, $I_c$ showed a minimal increase and did not degrade up to the largest strain that can be applied using the bending rig equivalent to 1.15% based on the sample thickness. However, in the case of alternate application of compressive and tensile bending strain, $I_c$ showed a larger degradation and a lower reversible limit when compared with the case of continuous application of the bending strain. When $I_c$ started to degrade significantly at the tension side, the reversibility ended, also at the compression side which is resulted from the permanent deformation like delamination or cracks that was induced due to tensile bending strain.