Analysis and experiment on mold and resin materials for the nanoimprint process are conducted in this study. We developed FEM analysis of indentation stress induced in mold materials when they come in contact with 1MPa expanded uniaxial stress. Experimental analyses of viscosity, thermal expansion coefficient, and shrinkage rate of acrylate-based UV resin are likewise undertaken. Experimentally, Hertzian indentation and adhesion tests are used as model test systems for the micro/nanoimprint process. For the study, indentation test variables investigated are the contact load for various mold materials such as Si, glass, and PDMS(polydimethylsiloxane). The adhesion test is performed to measure the maximum uniaxial load required to separate the mold from the resin material. The results highlight that the adhesion stresses are not negligible during the demoulding process, while the indentation stresses are negligible during the imprint process.