Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{ imes}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.