Need for plasma resistant ceramic materials has been continuously increased in semiconductor and display industry requiring plasma processing to realize ultra fine circuit process. Among promising candidates, alumina ceramics have still some advantages with respect to its economic aspect. In this study, fabrication of plasma resistant alumina ceramics was tried, and its processing optimization was also aimed. Careful processing control and thereby uniform microstructure of $Al_2O_3$ gave rise to enhanced plasma resistance, even comparable to market-governing commercial $Al_2O_3$. A further study is needed concerning ${eta}-Al_2O_3$ materials system, presumably playing a decisive role in decreasing plasma resistance of $Al_2O_3$ ceramics.