- 열초음파 접합 공정과 접합부의 신뢰성 평가에 관한 연구
- ㆍ 저자명
- 신영의,박진석,손선익,Shin. Young-Eui,Pak. Jin-Suk,Son. Sun-Eik
- ㆍ 간행물명
- 전기전자재료학회논문지
- ㆍ 권/호정보
- 2009년|22권 8호|pp.625-631 (7 pages)
- ㆍ 발행정보
- 한국전기전자재료학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199;^{circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.