This research investigates contact angle of Linear Guide Way through a experimental result and theoretical analysis. Since last ten years, most of researchers who concerned with the precision machinery and semiconductor device production etc. so the researches about Linear Guide Way have been unnoticed. The precision machinery and semiconductor device production system has the principle which transfers the mechanical moving to accuracy position control. The Linear Guide Way system has the principle which transfers mechanical moving to accuracy position control is very important to improve performance of the precision machinery and semiconductor device production system. So, In this research, in order to improvement for producing Linear Guide Way, bearing loading analysis and contact angle change through Linear Guide Way theoretical analysis and bearing modeling. Through this study, we may expect that there will be more improvement for producing Linear Guide Way.