The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.