One of the biggest challenges for mechanical micro/nano milling is the design and fabrication of high precision and high efficiency micro milling tools. Commercially available micro milling tools are either too expensive (around several hundred US dollars) or simply made from downsizing of macro milling tools, which is sometimes not appropriate for the specific micro/nano milling requirements. So the design and fabrication of custom micro milling tools are necessary. In this paper, a micro straight edge endmill (SEE) is designed. Static and dynamic FEM analyses have been done for the SEEs with different rake angles trying to identity their stiffness and natural frequencies. By wire electrical discharge machining (WEDM), the SEEs made of polycrystalline diamond (PCD) with three different rake angles have been fabricated. The evaluation milling on tungsten carbide (WC) and silicon wafer have processed on a nano milling center. Experimental results show the SEEs have a good ability to simultaneously micro/nano milling of both the side and bottom surfaces with submicron surface roughness, and the SEE has high accuracy for large aspect ratio thin wall machining. The milling experiments on silicon wafer have successfully demonstrated that ductile mode machining was achieved and the coolant played an important role in silicon wafer milling.