- 주사 플라즈마 법(SPM)을 이용한 소수성 표면처리
- ㆍ 저자명
- 김영기,최병정,양성채,Kim. Young-Gi,Choi. Byoung-Jung,Yang. Sung-Chae
- ㆍ 간행물명
- 전기전자재료학회논문지
- ㆍ 권/호정보
- 2010년|23권 1호|pp.10-13 (4 pages)
- ㆍ 발행정보
- 한국전기전자재료학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.