- 0.25 mm 초박형 두께를 가지는 회로기판형 리드프레임 백색 LED 램프
- ㆍ 저자명
- 유순재,김도형,Yu. Soon-Jae,Kim. Do-Hyung
- ㆍ 간행물명
- 전기전자재료학회논문지
- ㆍ 권/호정보
- 2010년|23권 1호|pp.34-37 (4 pages)
- ㆍ 발행정보
- 한국전기전자재료학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1;^{circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.