Recently, we have investigated the recovery of resources from the waste material of manufacturing printed circuit board. As printed circuit board or chip has become light, small, high reliability, it is necessary to reuse and recover resources from them. Especially, the printed circuit board that has been used for important mobile electronic pans are plated with min.0.03 ${mu}m$ to max.50 ${mu}m$. As increasing the cost of gold, raw material, chemicals, payments and waste material, it has been accelerated the competition for reuse and recovery. But, it is insufficiency of technician and equipments for the recovery of effective resource. In this paper, as analyzing the technical trend of gold recovery and waste back board from the manufacturing process of printed circuit board, it may be effective of recycling, further more it may be contributed to develop the valuable resources.