- 복합 착화제 첨가가 무전해 Ni-P 도금액의 특성에 미치는 영향
- ㆍ 저자명
- 이홍기,이호년,전준미,허진영,Lee. Hong-Kee,Lee. Ho-Nyun,Jeon. Jun-Mi,Hur. Jin-Young
- ㆍ 간행물명
- 한국표면공학회지
- ㆍ 권/호정보
- 2010년|43권 2호|pp.111-120 (10 pages)
- ㆍ 발행정보
- 한국표면공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.