Recently, the plastic resin such as PC, ABS are widely used in IT market. Especially, in most cases the keypads mounted on the mobile phone are the dual-injection-plated type. Environmental regulation is based on the quality of injection-molded products and the minimum process steps are required to avoid the plating defects. Various parameters to produce the injection-molded plastic products make it difficult to obtain the desired stability. However, the past experience and the use of CAE analysis make it possible to predict the problems occurred in injection molding process. Especially, the problems of the weld lines such as runner balancing, bending, deformation and forming defects can be solved systematically and minimized by CAE analysis. Through this study, the non-uniform volumetric shrinkage and the difference in temperature distribution induce the deformation and the high value of stress causes the problems such as crack.