This paper focuses on the thermal design of a signal processor in Micro-Wave Seeker. High temperature environment and ESS(Environmental Stress Screening) test condition should be considered in designing a signal processor. First, we performed the thermal analysis to know conditions under which a signal processor is thermally reliable. As a result of thermal analysis, we found that adopting heat transfer block to the thermally fragile components is most efficient, because the heat transfer block can control the thermal loads of the individual components. Next, we verified this solution by numerical simulation and experiment and concluded that thermal reliability of a signal processor can be achieved. Maximum temperature difference between numerical simulation and experiment is about $2^{circ}C$.