Recently, with the merits of simplicity, ease of mass production and cost effectiveness, a roll-to-roll (R2R) forming process is tried to be employed in the manufacturing of the circuit board, barrier ribs and other electronic device. In this study, the roll-to-roll process for the forming of micro-pattern in electronic device panel is designed and analyzed. In the preliminary experiments, two major defects, i.e., crack near the dimple wall and wrinkling on outside region of dimple, are found. The study on the crack prevention is carried out in previous works by authors. In this study, the cause of wrinkling and modification of tooling to prevent the wrinkling is studied. The main cause of wrinkling is considered to be the uneven material flow along the rolling direction. To reduce or to retard the wrinkling initiation, a dummy shape on outside the pattern is introduced. From the finite element analysis results, it is shown that the dummy shape can reduce the uneven material flow significantly. Finally the effect of dimensions of the dummy shape on material flow is investigated and the optimum dimensions are found.