기관회원 [로그인]
소속기관에서 받은 아이디, 비밀번호를 입력해 주세요.
개인회원 [로그인]

비회원 구매시 입력하신 핸드폰번호를 입력해 주세요.
본인 인증 후 구매내역을 확인하실 수 있습니다.

회원가입
서지반출
Prediction of thermal deformation considering the residual stresses for the PMMA-TSP laminated structure
[STEP1]서지반출 형식 선택
파일형식
@
서지도구
SNS
기타
[STEP2]서지반출 정보 선택
  • 제목
  • URL
돌아가기
확인
취소
  • Prediction of thermal deformation considering the residual stresses for the PMMA-TSP laminated structure
  • Prediction of thermal deformation considering the residual stresses for the PMMA-TSP laminated structure
저자명
Cho. Jung-Hyun,Lee. Moon-Kyu,Park. Seon-Mi,Hong. Seok-Moo,Kim. Nak-Soo
간행물명
Journal of mechanical science and technology
권/호정보
2011년|25권 12호|pp.3135-3140 (6 pages)
발행정보
대한기계학회
파일정보
정기간행물|ENG|
PDF텍스트
주제분야
기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

The use of polymethylmethacrylate (PMMA) plates is limited by some of their typical features, particularly the tendency to be deformed when conjugated with other materials, while remaining stable if it becomes homogeneous. This paper describes PMMA deformation caused by injection molding at high temperature. The relocation of the injection gate in order to minimize the deformation is also studied. Results rule out residual stresses as the main cause of the deformation, which are predicted by inverse engineering as described in the paper. Further study of residual stresses among different injection gates is made, and deformations of the PMMA-touch screen panel (TSP) laminated plate based on the locations of the injection gates are measured. In conclusion, one of the ways by which to reduce deformation at high temperature is to locate the injection gate at a symmetrical position of the plate.