- 활성금속 브레이징을 사용한 세라믹과 금속의 접합
- ㆍ 저자명
- 기세호,허증봉,정재필,김원중,Kee. Se-Ho,Xu. Zengfeng,Jung. Jae-Pil,Kim. Won-Joong
- ㆍ 간행물명
- 마이크로전자 및 패키징 학회지
- ㆍ 권/호정보
- 2011년|18권 3호|pp.1-7 (7 pages)
- ㆍ 발행정보
- 한국마이크로전자및패키징학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Active brazing of ceramic to metal is reviewed in this paper. As one of the key aspect in joint techniques, active brazing has been developed to simplify the manufacturing procedure of brazed joints between ceramic and metal. The active filler metal includes Ag-Cu-Ti series, Cu-Ti series, Co-Ti series and so on. The active filler metal which supplies the chemical bonds between ceramic and metal, enhances the wetting of filler metal on ceramic surface and eliminates the need for metallization treatments. The residual stress caused by difference of coefficient of thermal expansion between ceramic and metal, holds a direct influence on the bonding strength and even results in a fracture. Good joints of ceramic to metal promote the miniaturization and simplicity of electronic components with multifunction.