In this study, the bending and twisting deformations of a laminated material composed of PMMA (Poly Methyl Methacrylate) and TSP (Touch Screen Panel) were analyzed at a high temperature condition. At similar conditions, a PC (Polycarbonate)/TSP material had little deformation, but the PMMA-TSP material showed excessive bending deformation with twisting. To determine the factors that cause the deformation, 5 factors relating to material properties were systematically analyzed using FE (Finite element) analysis. The results demonstrated that variations in each of the 5 factors affect the deformation of material, and the strongest influence on the deformation behavior of the material at high temperature comes from the CTE, residual stress, and the creep effect. The validity of the analytical research was confirmed by comparing not only differences in the material properties of PMMA and PC, but also by comparing the results of the FE analysis of PMMA-TSP and PC-TSP. In the analysis, it was discovered that CTE, creep coefficient, and residual stress are the most significant causes of deformation of the laminated material.