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진공 프린팅 성형 인쇄법(VPES)을 이용한 R.G.B.Y(Red, Green, Blue, Yellow) LED 광원 연구
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  • 진공 프린팅 성형 인쇄법(VPES)을 이용한 R.G.B.Y(Red, Green, Blue, Yellow) LED 광원 연구
저자명
장민석,김영우,신기해,박정욱,홍진표,송상빈,김재필,Jang. Min-Suk,Kim. Yeoung-Woo,Shin. Gi-Hae,Park. Joung-Wook,Hong. Jin-Pyo,Song. Sang-Bin,Kim. Jae-Pi
간행물명
照明·電氣設備學會論文誌
권/호정보
2011년|25권 2호|pp.10-18 (9 pages)
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한국조명전기설비학회
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].