Silicon carbide (SiC) ceramic has been widely used in modem industry, However, the beneficial properties of SiC ceramic make machining difficult and costly by conventional machining methods. This paper proposes a new process of machining SiC ceramic using end electric discharge (ED) milling. The process is able to effectively machine a large surface area on SiC ceramic at low cost and no environmental pollution. The effects of emulsion concentration, emulsion flux, milling depth, copper electrode number, and copper electrode diameter on the process performance such as the material removal rate, electrode wear ratio, and surface roughness have been investigated. In addition, the microstructure of the machined surface is examined with a scanning electron microscope, and the material removal mechanism of SiC ceramic during end ED milling is obtained.