Lots of 2D vision algorithms have been applied for inspection. However, these 2D vision algorithms have limitation in inspection applications which require 3D information data such as the height of semiconductor chips. Stereo vision is a well known method to measure the distance from the camera to the object to be measured. But it is difficult to apply for inspection directly because of its measurement error. In this paper, we propose two adjustment methods to reduce the error of the measured height data for stereo vision. The weight value based model is used to minimize the mean squared error. The average value based model is used with simple concept to reduce the measured error. The effect of these algorithms has been proved through the experiments which measure the height of semiconductor chips.