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Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting
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  • Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting
  • Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting
저자명
Ko. Tae-Jo,Yoon. In-Joon
간행물명
International journal of precision engineering and manufacturing
권/호정보
2012년|13권 1호|pp.5-10 (6 pages)
발행정보
한국정밀공학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Ceramic materials are very hard and brittle and are not easily cut with typical methods, such as grinding or cutting. These materials are cut mostly using the grinding process, but the material removal rate or process efficiency is not satisfactory. For this reason, a hybrid electroplated diamond abrasive tool was proposed for cutting and grinding. The tool looks like a typical endmill or electroplated grinding wheel, but it has a cutting edge and flutes without a radial land and clearance. After electroplating the cutting tools with diamond abrasives, cutting experiments were carried out. The results showed that a ductile cutting regime was possible with the diamond abrasives. In addition, the cutting speed could be increased as in typical cutting. The tool life, defined as the rate of detachment of the abrasive, was also satisfactory. Consequently, this type of cutting tool is useful for cutting hard materials such as ceramics or glass that are used in advanced industrial products.