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Analysis of wire-drawing process with friction and thermal conditions obtained by inverse engineering
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  • Analysis of wire-drawing process with friction and thermal conditions obtained by inverse engineering
  • Analysis of wire-drawing process with friction and thermal conditions obtained by inverse engineering
저자명
Moon. Changsun,Kim. Naksoo
간행물명
Journal of mechanical science and technology
권/호정보
2012년|26권 9호|pp.2903-2911 (9 pages)
발행정보
대한기계학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

In cold wire-drawing process, which is performed at room temperature, heat is generated because of plastic work and friction at the workpiece-die interface. Temperature distribution in both the workpiece and the die affects thermal expansion, deformation pattern, and elastic recovery. These effects produce the final dimension of the drawn products. We propose inverse engineering procedures to determine friction and thermal conditions by comparing simple measurements with the computational results of the drawing power and the temperature changes of the die. The conditions were then used to simulate numerically the deformation behavior of the wire and the temperature distribution in the die. The thermal effects on the quality of drawn products were investigated based on the prediction of the final dimensions of the products. Therefore, thermal effects should not be ignored even in cold wire-drawing process because reasonable numerical results were acquired in comparing the experiments.