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공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화
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  • 공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화
저자명
김종혁,권원태,이수일,Kim. Jong-Hyok,Kwon. Won-Tae,Lee. Soo-Il
간행물명
한국정밀공학회지
권/호정보
2012년|29권 8호|pp.879-886 (8 pages)
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한국정밀공학회
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and accuracy is necessary. In this research, an attempt was made to design the ultra sonic horn within acceptable natural frequency while the manufacturing cost was kept as low as possible. For this purpose, among the 18 tolerances of physical terms of the ultrasonic horn, the most important 4 factors were selected using Taguchi method. The equation to relate those main factors and the natural frequency was made using response surface method. Finally, optimal design scheme for minimum manufacturing cost without a loss of performance was determined using SQP method.