$BaTiO_3$ based multilayer ceramic capacitors with Ni electrodes can be explained as 2-2 composites with different thermal expansion coefficient and sintering behaviors. To achieve the high capacitance and reliability of MLCCs, a homogenous Ni electrode configuration with high connectivity is required. We controlled the heating rates during sintering to achieve densification by suppressing grain growth. Experimental results revealed that a large heating rate gave high connectivity of Ni electrode, high capacitance, small dissipation factor, high breakdown voltage, and high reliability of MLCC chips.