Cleaning process occupies more than 35 % of semiconductor fabrication and handles the reliability of products and device yield which is becoming more important in semiconductor fabrication. In spite of its high efficiency, RCA cleaning wastes a huge amount of chemical and water, and exerts the negative effect on the environment. The physical cleaning becomes a key technology with super diluted chemistry in lower temperature for green nanotechnology. This paper deals with an optimization of PVA brush scrubbing which is the most popular physical cleaning method for defect-free surface in Post-CMP cleaning. The particle adhesion force depending on the interfacial reaction was analyzed by the developed friction force monitoring system, real contact area system and AFM scratch test. The experimental result showed that the increase of friction force according to brush pressure leads to decrease of contamination and increase of total scratches. The particle removal force depending on the interfacial reaction was analyzed by detected friction force and the surface defects were verified by AFM and FE-SEM. Therefore, this paper suggests the optimization of PVA brush cleaning condition associated with cleaning efficiency and surface defect for green manufacturing.