A numerical analysis of solid-liquid phase change was performed on a heat transfer module which consisted of circulating water path (BRINE), heat transfer plate (HTP) and phase change material (PCM) layers, such as high temperature PCM (HPCM, $78{sim}79^{circ}C$) and low temperature PCM (LPCM, $28{sim}29^{circ}C$). There were five arrangements, consisting of BRINE, HTP, LPCM and HPCM layers in the heat transfer module. The time and heat transfer rate for melting/solidification was compared to their arrangements, against each other. As results, the numerical time without convection was longer than the experimental one for melting/solidification. Moreover, the melting/solidification with the BRINE I-LPCM-BRINE II-HPCM arrangement was faster(10 hours) than the others; HPCM-BRINE-LPCM, BRINE I-HPCM-LPCM-BRINE II one.