Effects of copper hydroxide(II) on the curing and the corrosion resistance of electrocoating were investigated by MEK rubbing test, electrochemical impedance spectroscopy (EIS) and Thermo-gravimetric analysis (TGA). Curing performance of electrocoating was lowered with increasing the content of copper hydroxide(II) as evidenced by the MEK rub performance which decreased with increasing the content of copper hydroxide(II). This indicates copper hydroxide(II) affected the blocked isocyanate reaction in the coatings, by the decomposition of copper hydroxide(II) to CuO and $H_2O$ during reaction of isocyanate with nuclephiles. Corrosion resistance of coatings also decreased with the content of copper hydroxide. This reflects the higher barrier property in coatings with higher curing performance.