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서지반출
A Self-Learning Method for Automatic Alignment in Wafer Processing
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  • A Self-Learning Method for Automatic Alignment in Wafer Processing
  • A Self-Learning Method for Automatic Alignment in Wafer Processing
저자명
Kim. Hyung-Tae,Lee. Kang-Won,Yang. Hae-Jeong,Kim. Sung-Chul
간행물명
International journal of precision engineering and manufacturing
권/호정보
2013년|14권 2호|pp.215-221 (7 pages)
발행정보
한국정밀공학회
파일정보
정기간행물|ENG|
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

We propose a self-learning method for automatic wafer alignment in the semiconductor manufacturing process. A feed forward neural network is trained by and used for wafer alignment. The network determines the movement of kinematic parts from the misalignment inspected by machine vision. However, it is time-consuming and inconvenient to obtain training data in this way. So, we built an automatic learning rule to gather the data and train the network. The network may determine wrong outputs and cause other misalignments at first, but the error can decrease as the training proceeds. The training sets consisted of a variation of misalignment data and the movement of an alignment stage. Five recent sets are used for training and others are dismissed or forgotten. This retrained network tried aligning, measured misalignment, and made new training sets. This sequence makes it possible to acquire alignment skill and automate the process. After learning, automatic alignment accomplished sub-pixel accuracy for several cases of misalignment. The result showed that the proposed method could be applied to the semiconductor manufacturing process. Its performance improved about 6% compared with conventional algorithms.