The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.