This paper presents a solid liquid inter-diffusion (SLID) bonding process using nickel-tin. By using two metals with different melting points, $Ni_3Sn_4$, an intermetallic compound (IMC) at 523K was formed. Unlike pure metal, the IMC can be used in high temperature applications of up to 800K without failure. The formation energy of $Ni_3Sn_4$ IMC was calculated to be 23.15 kJ/mol from the experimental result. Compared to the traditional soldering technique, a higher temperature resistance bonding joint can be achieved using the nickel-tin SLID bonding technique.