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SiC based Technology for High Power Electronics and Packaging Applications
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  • SiC based Technology for High Power Electronics and Packaging Applications
  • SiC based Technology for High Power Electronics and Packaging Applications
저자명
Sharma. Ashutosh,Lee. Soon Jae,Jang. Young Joo,Jung. Jae Pil
간행물명
마이크로전자 및 패키징 학회지
권/호정보
2014년|21권 2호|pp.71-78 (8 pages)
발행정보
한국마이크로전자및패키징학회
파일정보
정기간행물|ENG|
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

Silicon has been most widely used semiconductor material for power electronic systems. However, Si-based power devices have attained their working limits and there are a lot of efforts for alternative Si-based power devices for better performance. Advances in power electronics have improved the efficiency, size, weight and materials cost. New wide band gap materials such as SiC have now been introduced for high power applications. SiC power devices have been evolved from lab scale to a viable alternative to Si electronics in high-efficiency and high-power density applications. In this article, the potential impact of SiC devices for power applications will be discussed along with their Si counterpart in terms of higher switching performance, higher voltages and higher power density. The recent progress in the development of high voltage power semiconductor devices is reviewed. Future trends in device development and industrialization are also addressed.