- 에틸렌디아민을 착화제로 사용하는 팔라듐-니켈 합금도금
- ㆍ 저자명
- 최병하,손호상,김경태,손인준,Choi. Byungha,Sohn. Ho-Sang,Kim. Kyung Tae,Son. Injoon
- ㆍ 간행물명
- 한국표면공학회지
- ㆍ 권/호정보
- 2014년|47권 5호|pp.215-220 (6 pages)
- ㆍ 발행정보
- 한국표면공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.