법랑질의 표면처리에 따른 광중합형 글래스아이오노머 시멘트의 전단결합강도를 알아보고자 사람 소구치 80개를 선택하여 8개군으로 나누어 전단 결합 강도를 측정하고, 접착 파절의 양상을 평가하여 다음과 같은 결과를 얻었다. 1. 37% 인산용액으로 부식한 후 건조상태에서 글래스아이오노머 시멘트, 광중합형 레진, 화학중합형 레진으로 각각 부착한 실험군에서 그래스아이오노머 시멘트 실험군의 전단결합강도는 두 군과 유의한 차가 없었으나 화학중합형 레진군의 그것은 광중합형 레진군에 비해 유의성있게 낮았다 (P<0.05). 2. 37% 인산 실험군, 10% 폴리아크릴산 실험군, 1.23% APF 실험군, 산처리하지 않은 실험군의 습한 상태에서 부착한 글래스아이오노머 시멘트의 전단결합강도에서 산처리하지않은 실험군의 그것이 유의성 있게 낮았으며, 그 외 군간에는 유의성 있는 차이가 없었다 (P<0.05). 3. 글래스아이오노머 실험군에서 습기의 존재가 전단결합강도에 유의성 있는 영향을 미치지 않았다 (P<0.05). 4. 산부식처리를 하지 않은 군의 접착제 잔류 지수가 가장 낮았으며 37% 인산용앵으로 처리한 군의 접착제 잔류지수가 가장 높았다.
The purpose of this study was to evaluate the shear bond strength of light cured glass ionomer cement to enamel surface which treated with 37% phosphoric acid, 10% polyacrylic acid, 1.23% acidulated phosphate fluoride gel and no etching agent. To compare the shear bond strength of glass ionomer cement, light-cured composite resin and chemically-cured composite resin were empoloyed as controls. Eight experiments groups were composed. 10 specimens of each group were bonded by metal bracket by tested in universal testing machine for shear bond strength, in stereoscope for adhesive remnants index. The data were evaluated statistically by SPSS/PC+. The results were as follows. 1. Among the groups of 37% phosphoric acid treated and dry and bonded with light cured glass ionomer, light cured composite resin, and chemically cured composite resin, the shear bond strength of glass ionomer group showed no significant difference to the others, but the shear bond strength of chemically cured resin showed statistically lower than that of light cured resin V0.05). 2. The shear bond strengths of glass ionomer cement to´ enamel treated group with 1.23% acidulated phosphate fluoride gel and 10% polyacrylic acid and 37% phosphoric acid showed ´statistically higher than that of no etched enamel group(p<0.05). 3. In the groups of glass ionomer cement, the presence of moisture was not significantly effect to the shear bond strength (p<0.05). 4. After debonding, no etched enamel group showed less residual materials on the. enamel surface than the group of enamel etched with 37% phosphoric acid.
