- 프릿트 및 소결조건이 Ag 및 Ag/Pd계 후막도체의 미세구조와 전기적성질에 미치는 영향
- ㆍ 저자명
- 구본급,김호기
- ㆍ 간행물명
- 요업학회지
- ㆍ 권/호정보
- 1988년|25권 6호|pp.623-630 (8 pages)
- ㆍ 발행정보
- 한국세라믹학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
As a function of the composition and content of frit, the electrical property of Ag and Ag/Pd thick film conductors were investigated with microstructure. With increasing sintering temperature in Ag-frit thick film conductors, electrical sheet resistivity decreased, but again increased above 80$0^{circ}C$. And when frit contents is 5wt%, compact and homogenious microstructure can be obtained, then electrical sheet resistivity has minimum value. In Ag/Pd-frit film conductor, the electrical sheet resistivity decreased with increasing sintering temperature. The system which having frit with low softing point has lower sheet resistivity then to add high softening point frit.