The three-dimensional profile of a solder fillet is predicted by minimizing the surface tension and gravity energies of the solder joint using finite element modeling. Geometric complexity stemming from the inclined plane of the gullwing lead is resolved by employing three element types. These element types are used to describe the joint profile formed on the vertical, inclined and interfacial planes. The predicted solder joint profiles show good agreements with the experimental data provided that the solder volume is adjusted considering the wicking effects. Effects of the pad length, inclined lead angle and solder volume on joint profiles are also investigated.