During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.