We fabricated Bi-2223 multi-filaments superconductor tape and evaluated the effect of twisting on the microstructural evolution and critical current. Twist pitches of the tapes are in the range of 70- 8mm and uniformly deformed. It was observed that grain size and the degree of texture decreased as decreasing pitch probably due to the formation of the irregular interface between Ag and filaments. In addition critical current of the tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tape(12.5 A). These reduction of critical current may be related to the interface irregularity smaller grain size worse texture and the presence of cracks due to the induced strain during twisting processing.