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A Study on the Thermal Performance of Embossing Surface Sandwich Panel
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  • A Study on the Thermal Performance of Embossing Surface Sandwich Panel
  • A Study on the Thermal Performance of Embossing Surface Sandwich Panel
저자명
Son. Cheol-Soo
간행물명
International journal of air-conditioning and refrigeration
권/호정보
2001년|9권 2호|pp.69-76 (8 pages)
발행정보
대한설비공학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel in higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.